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Laser Scribing
Laser Scribing

Laser Scribing

  • Substrate (Al2O3 96%)
    • Dielectric constant (1MHz): 9.5
    • Volume Resistivity(25 deg C)>1014 ohms-cm
    • Size: Max 5.0" x 7.0"
    • Thickness: 0.015" ~ 0.05"
  • Scribing Ability
    • Thickness: 0.010" to 0.060"
    • Size: 7.0" sq. Max
  • Hole Cutting Ability
    • Diameter: Min 0.006"
Screen Printing & Firing
Screen Printing & Firing

Screen Printing & Firing

  • Print Area
    • Substrate size : Max 6” X 6”
  • Fine Line Print
    • General conductor paste: 3 mils line & 3 mils space
    • Au: 2 mils line & 2 mils space
  • Through Hole, Slot Hole & Edge Print
    • Through hole: Min Φ 0.006"
    • Slot hole: Min Φ 0.006"
    • All kinds of edge print
  • Multi Layer Print
    • Single side print: 7 layers
    • Double side print: 6 layers (Each side)
Laser Trimming

Laser Trimming

  • Trim Methods
    • Passive trim
    • Active trim (Current,Voltage,Frequency)
    • Ratio trim
    • Capacitance trim
  • Accuracy
    • Passive trim tolerance: +/- 0.02%
    • Ratio trim tolerance: +/- 0.1%
    • Active trim tolerance: +/- 0.05%
  • Excellent Repeatability
SMT / DIE BONDER
SMT / DIE BONDER

SMT / DIE BONDING

  • SMT
    • Available Chip Size: 0201 Size
    • Melf Type: 1.6 x 0.8 Dia
    • PLCC: ~ 100 pins
    • QFP: ~ 100 pins / 0.65mm Pitch
    • Maximum Components Thickness: 10mm
    • Maximum Board Size: 330 x 250mm
  • DIE BONDER
    • Available Types: Dispensing, Stamping, Dotting
    • Die Size: 0.5mm x 0.5mm ~ 35mm x 35mm
    • Accuracy: +/-12um
    • QFP: ~ 100 pins / 0.65mm Pitch
    • Work Area: 50mm x 50mm ~ 200mm x 200mm
    • Speed: 1.0sec/chip (UPH:3600)
WIRE BONDER

WIRE BONDING

  • Au wire
    • Standard Substrate size : 4”x6”, 4”x4” typical
    • Bonding Type : Thermo sonic Ball bonding
    • Wire diameter : 0.8 ~ 2.0 mils Typical
  • Al wire
    • Standard Substrate size : 4”x4” typical
    • Bonding Type : Ultrasonic wedge bonding
    • Wire diameter : 4~20mils

Electrical Test

  • Manual and automated digital, Analog, RF, noise
  • Equipped with computerized tester
  • Active burn in
  • Temperature cycle
  • Fine and gross leak
  • Particle impact noise detection
  • Active burn in
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