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Process Highlights
W

Business Areas

Sensor

Pressure sensor assembly

  • Sensor LineSensor Line
  • RTV dispense & Die bondingRTV dispense & Die bonding
  • Wire bondingWire bonding
  • Active trimmingActive trimming
  • Epoxy dispenseEpoxy dispense
  • Die bonding : 0.5mm x 0.5mm ~35mm x 35mm Die size
    Bonding accuracy +/- 12.0um
    Conductive & Non conductive epoxy, RTV
  • Wire bonding : 0.8mil ~ 2.0mils Au wire ball bonding
    110mm x 150mm Work area
  • Capping : Plastic & Ceramic Cap
    Epoxy dispense Gel filling & Vacuum process
    Using various type of fixtures for every process
  • Sensor die range : Low pressure ; 0.1 ~ 3.0 PSI
    Standard pressure ; 5.0 ~ 100 PSI
  • Pretest systemPretest system
  • TC test systemTC test system
  • Final test systemFinal test system
  • Leak test systemLeak test system
  • Wire pull & ball shearWire pull & ball shear
  • X-ray InspectionX-ray Inspection
  • Pretest
    • Pretest & TC test system
    • Offset, TCR, TCS, Sensitivity & Resistance trim target value
  • Passive trim & Zero offset active trimming by auto program
  • Final test
    • Final test system
    • Offset, Impedance, Sensitivity
  • Others
    • Wire pull & Ball shear test
    • Leak test
    • X-ray quality checks
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